Extreme Ultraviolet Lithography (EUVL) is a technology which can make microprocessors hundred times powerful and more faster than what it is, today.
Using the Extreme Ultraviolet Technology, the memory chips would be able to store thousand times more information as compared to its ability to store information in today's date.
Today, in order to make micro-circuits, Optical Lithography technology is used. Soon, EUVL Technology will replace the Optical Lithography technology to make microprocessors more faster and with more memory.
How the EUVL Technology works ?
EUVL Technology uses the light of extremely short wavelength of 13.5 nm.
`It requires variety of elements including the light source, optics, masks, photoresist, and lithography tools.
The biggest challenge to implement this technology is to generate the Powerful EUV Beam of the extremely short wavelength of 13.5 nm. This EUV Beam can be taken out from the Plasma having high temperature and high density.
The EUV beam taken out from the plasma is collected by the condensing mirror, passes through a point called the intermediate focus (IF) and illuminates a reflection-type mask after it has been reshaped by the illumination optics. The EUV beam reflected by the mask is exposed by the projection optics to form a pattern on photoresist that is coated on a wafer surface.
The difference between the Optical Lithography Technology and the Extreme Ultraviolet Lithography Technology is that, light is refracted through camera lenses onto the wafer in case of Optical Lithography technology while in EUV Technology, extreme ultraviolet light which is operating at a different wavelength has different properties and must be reflected through mirrors onto the wafer instead of camera lenses.
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